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材料介紹JP
基板、P.P：南亞、台耀、Rogers、鋁板、銅板、軟板、軟硬結合板
南亞
台耀
Rogers
Capability
製程能力
| 類 別 | 描 述 | 製程能力 |
|---|---|---|
| File format | Gerber-optimal format | 274-X, DPF |
| Drill file | Corresponding X,Y locations and hold diameters | |
| Dimensions | Max. dimensions of product | Testing board:720mmX510mm→Mass：700x510mm |
| Without Testing board:762mmX620mm→Mass：700x510mm | ||
| Standard PCB Thickness | 1.6mm +/- 10% (0.062" +/- 10%) | |
| Single/double-side PCB: 0.2mm +/- 0.1mm (0.008" +/- 0.004") | ||
| 4-layer PCB: 0.4mm +/- 0.1mm (0.016" +/- 0.004") | ||
| 6-layer PCB: 0.6mm +/- 0.1mm (0.024" +/- 0.004") | ||
| Min. thickness | 8-layer PCB: 0.9mm +/- 0.1mm (0.036" +/- 0.004") | |
| PCB Thickness | 10-layer PCB: 1.0mm +/- 0.12mm (0.04" +/- 0.005") | |
| 12-layer PCB: 1.2mm +/- 0.12mm (0.048" +/- 0.005") | ||
| Max. thickness | 6.0mm +/- 10% | |
| (0.236" +/- 10% ) | ||
| Warp of PCB | < 7/1000 | |
| FR-4、High TG FR-4 (170℃/180℃)、ISOLA(FR-408、FR-408HR)、ROGERS、Halogen free、TU(883) | ||
| FR4 Thickness (standard) | 1.6mm (0.062") | |
| Board meaterial | High TG FR4 (170 deg C) (standard) | 1.6mm (0.062") |
| Metal board | Aluminum substrate,copper substrate | |
| Max. number of layers | 36 layers | |
| Cutting | Min. thickness of inner layers | 0.0508mm (0.002") |
| (excluding copper thickness) | ||
| Minimum size | 0.1mm (0.004")laser drill, | |
| 0.15mm(0.006")mechanical drill→Mass: 0.2mm(0.008") | ||
| Maximum size | 6.35mm | |
| Drills | Drill hole deviation | +/- 0.002" (0.050mm) |
| PTH diameter tolerance | +/- 0.003" (0.075mm) | |
| Non-PTH diameter tolerance | +/- 0.002" (0.050mm) | |
| Annual ring isolation | +/- 0.005" (0.127mm) | |
| Copper plating | Min. hole copper | 0.0008" |
| Aspect ratio | 1月20日 | |
| Trace width tolerance | +/- 20% (impedance control +/- 1mil) | |
| Min. trace width/spacing(1oz)copper base 1/3oz | 0.0025"/ 0.0025" (0.1mm)→Mass:0.004"/0.004" | |
| Min. trace width/spacing(1oz)copper base 1/2oz | 0.005"/ 0.005" (0.13mm) | |
| Etching | Min. trace width/spacing(2oz) | 0.006"/ 0.006" (0.15mm) |
| Min. trace width/spacing(3oz) | 0.009"/ 0.009" (0.23mm) | |
| Min. trace width/spacing(4oz) | 0.013"/ 0.013" (0.33mm) | |
| MIn. clearance between hole and inner trace | 0.006"(0.15mm) | |
| Inner layer | Min. inner hole isolatioin ring | 0.006"(0.15mm) |
| Inter-layer Reqistration | +/- 0.003"(0.08mm) | |
| Color | Green, Light gree, matt green, white, black, yellow, red, blue, clear | |
| Solder Mask | Min. space beweent solder mask to make dams | 0.003" |
| Thickness of solder mask | 0.001" | |
| Color | White, black, yellow, red, blue, green | |
| Silkscreen | Min. line width | 0.004" |
| Min. height/width | 0.024" / 0.032" | |
| Electro tests | AOI Test | Yes |
| Flying probe test | Yes | |
| Impedance control | Tolerance | +/- 10% |
| Impedance tester | POLAR CITS800S4 | |
| Form and hole expansion | +/- 0.15mm (0.006") | |
| CNC tolerance | +/- 0.15mm (0.006") | |
| CNC Routing | V-Cut depth (board th. > =1.0mm ) | +/- 0.1mm (0.004") |
| V-Cut deviation | +/- 0.1mm (0.004") | |
| SEMI HOLE | Yes | |
| Surface treatment | HASL/ Lead-free HASL/ Immersion gold/ Immersion Silver/ Immersion tin/ OSP/ Full (selective)body gold plating/ Gold | |
| finger plating/ Carbon ink/ ENEPIG | ||
| Blind buried hole | 2+N+2 | Yes |
| Via in Pad | Yes | |