1.Scrubbing、Micro-etching、Drying

2.Dry Film、Cooling down

3.Exposing、Static placing

4.Development、Copper etching、Film stripping

5.Drill Rivets

1.Cleaning、Micro-etching、Hot water rinsing、Black Oxide、Water rinsing、DI water rinsing、Drying

2.Stacking、Hot press、Cold press、Transformation

3.Drill target hole

1.Tooling hole setting

2.CNC Drilling

3.Tooling hole withdraw

4.Flatness treatment

1.Rescrubbing、High press rinsing

2.Swelling bath、De-smear、Neutralization

3.Conditioning、Micro-etching、Activation、restoring、Electro less copper deposition

4.Sulfuric acid dip、Copper electro panel plating

1.Scrubbing、Micro-etching、Drying

2.Dry File、Cooling down

3.Exposing、Static Placing

4.Development

1.Remove contamination、Micro-etching、Sulfuric acid dip、Sulfuric acid copper plating、Sulfamic Acid dip、Etch resist(Tin/Lead)、Water rinsing

2.Film stripping、etching、Stripping line

1.Scrubbing、Micro-etching、DI water rinsing、Drying、Cooling down

2.Solder resist coating

3.Pre-dry

4.Exposing

5.Development

6.Drying

1.Make screen

2.Legend printing

3.Baking

1.Micro-etching、Pre-dip、Electroplating Ni、Pre-dip、Gold plating

2.Water rinsing、Drying

1.Cleaning、Flux coating

2.Hot air solder leveling

3.Cooling down、Hot water rinsing、Cool water rinsing、Drying

1.CNC Routing

2.Gold finger beveling

3.V-scoring

4.Cleaning

1.Electrical testing

2.Impedance testing

3.FQC

4.Vacuum packing、Shipping